Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
نویسندگان
چکیده
منابع مشابه
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
3D integration with through-silicon via (TSV) is a promising candidate to perform system-level integration with smaller package size, higher interconnection density, and better performance. TSV fabrication is the key technology to permit communications between various strata of the 3D integration system. TSV fabrication steps, such as etching, isolation, metallization processes, and related fai...
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Through-silicon via (TSV) is a key component for the vertical interconnection of a 3D IC which can provide a significant performance improvement with greatly reduced physical length of channels among vertically integrated chips. TSV technology is used both in three-dimensional stacked ICs (3D-SICs), as well as in so-called 2.5D-SICs and supports high performance, small footprint and lower power...
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Roshan Weerasekera, Dinesh Pamunuwa, Matt Grange † †Centre for Microsystems Engineering, Faculty of Science & Technology, Lancaster University, Lancaster LA1 4YR, UK. Email: {r.weerasekera,d.pamunuwa,m.grange}@lancaster.ac.uk Hannu Tenhunen, Li-Rong Zheng ∗ Department of Electronics, Computer, and Software Systems, KTH School of Information and Communication Technologies, ELECTRUM 229, 164 40 K...
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ژورنال
عنوان ژورنال: Nanoscale Research Letters
سال: 2017
ISSN: 1931-7573,1556-276X
DOI: 10.1186/s11671-017-1831-4